Electronics Forum | Fri Aug 13 07:18:19 EDT 1999 | Brian Conner
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Thu Mar 01 00:27:58 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 00:29:08 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
Electronics Forum | Thu Aug 12 19:30:22 EDT 1999 | Kris Harris
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Wed Aug 11 15:48:54 EDT 1999 | JohnW
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Tue Sep 22 11:20:08 EDT 1998 | S Maganti
We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along with
Electronics Forum | Sat Mar 28 06:59:03 EDT 2015 | robertwillis
I would agree with the comments so far its much better to have some pre heat. You have not explained why bottom side preheat is a problem. Even having some input will help balance the process. Assume there is some thing on the back side that is a pro
